According to an embodiment, an electrode array for a transmodiolar implant is disclosed. The implant includes a substrate, a conductive metal located at a plurality of discrete portions on the substrate； and a single layer of insulation material over the conductive metal and the substrate. The single layer of insulation material includes a plurality of apertures that expose the conductive metal, the exposed conductive metal forming a plurality of electrodes, the electrode array having a Young's modulus of at least 100 GPa.
