PROBLEM TO BE SOLVED: To provide a probe such that adhesive agent is adapted not to wrap around the edge of a device substrate such as a semiconductor substrate but to flow into a groove provided on a support substrate.SOLUTION: In a probe, a device substrate 1 on which a plurality of capacitance type cells are arranged and an edge part provided with lead terminals 5 of an external wiring board 4 that is electrically connected to outside are mounted on the same support substrate 2. Electrode pads 7 connected to the cells of the device substrate 1 and the lead terminals 5 of the external wiring board 4 are electrically connected. At least one groove 3 is provided on the surface of the support substrate 2. The device substrate 1 is bonded on the support substrate 2 by adhesive agent. The edge part having the electrode pads 7 of the device substrate 1 is located on the groove 3.COPYRIGHT: (C)2014,JPO&INPIT【課題】接着剤が半導体基板などのデバイス基板の端部にまわり込まず、支持基板に設けられた溝に流れ込む様にした探触子を提供する。【解決手段】探触子は、複数の静電容量型セルを配置したデバイス基板1と、外部と電気的に接続される外部配線基板4のリード端子5がある端部とが、同一の支持基板2上に搭載され、デバイス基板1のセルに接続されている電極パッド7と配線基板4のリード端子5とが電気的に接続されている。支持基板2の表面に少なくとも1つの溝3が設けられており、デバイス基板1が接着剤により支持基板2上に接着され、デバイス基板1の電極パッド7がある端部が溝3上に位置している。【選択図】図1
