An imaging module according to the present invention comprises: an imaging element having an electrode surface and an imaging element electrode； a substrate； a signal cable having a conductor； and a resin mold. A wiring of the substrate has an electrode terminal and a cable terminal. The imaging element electrode is electrically connected to the electrode terminal via a solder. The conductor is electrically connected to the cable terminal via a solder. The resin mold covers the electrode surface, the cable terminal, the conductor, and the solders. In a projection plane of the imaging element viewed from the direction toward the signal cable from the imaging element, the substrate, the resin mold, and the signal cable are disposed inside the contour of the imaging element.
