An ultrafine imaging module that can be easily manufactured while maintaining high reliability is provided. A first embedded conductor embedded in a main body, a second embedded conductor embedded in the main body and longer than the first embedded conductor, a part of the first embedded conductor and one of the second embedded conductors A first mounting terminal that forms a portion, a second mounting terminal that is a part of the first embedded conductor, and a first groove portion provided between the first side surface and the second side surface, and a second embedded portion A third groove having a third mounting terminal that is a part of the conductor and located between the first groove and the second groove in the extending direction of the main body, and the second groove provided between the first and second side surfaces The connection body 30 having a third groove portion is provided. [Selection] Figure 1【課題】高い信頼性を維持しつつ、容易に製造することができる極細の撮像モジュールを提供する。【解決手段】本体の内部に埋め込まれた第１埋め込み導体と、本体の内部に埋め込まれ第１埋め込み導体よりも長い第２埋め込み導体と、第１埋め込み導体の一部と第２埋め込み導体の一部とを構成する第１実装端子３４と、第１埋め込み導体の一部である第２実装端子を有するとともに第１側面と第２側面との間に設けられた第１溝部と、第２埋め込み導体の一部である第３実装端子を有するとともに第１側面と第２側面との間に設けられた第２溝部と、本体の延在方向において第１溝部と第２溝部との間に位置する第３溝部とを有する接続体３０を備える。【選択図】図１
