The invention is a composite resin particle useful as an additive for paints or coatings, powder coatings, cosmetic additives, slush molding resins, spacer for electronic part assembly, standard particles for electric measurement devices, toner, hot melt adhesive as well as other molding materials. Said composite resin particle comprises a resin microparticle (A) depositing on the surface of a resin particle (B) wherein the shape factor (SF-1) of said composite resin particle is 115 to 800. It is also a composite resin particle comprising a resin microparticle (A) depositing on the surface of a resin particle (B) wherein the acid vale of a resin (b) constituting the resin particle (B) is 5 to 100.
