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Sensor substrate and method of fabricating same
专利权人:
Rajiv Shah;Shaun Pendo;Edward Chernoff
发明人:
Shaun Pendo,Rajiv Shah,Edward Chernoff
申请号:
US11924402
公开号:
US08821793B2
申请日:
2007.10.25
申请国别(地区):
US
年份:
2014
代理人:
摘要:
A substrate with hermetically sealed vias extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One side of the substrate may include a sensing element and another side of the substrate may include sensing electronics.
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