An image pickup apparatus includes a substrate 2, on a first surface 2i of which a light receiving section 3 and a peripheral circuit section 4 are formed, a multilayer wiring layer 7 stacked on the first surface 2i and including a plurality of metal layers 6 and insulating layers 5, a translucent cover 10 located on the multilayer wiring layer 7, and a side surface sealing member 10z extending from a peripheral section of a surface 10t in the translucent cover 10 to the substrate 2 side while having a frame shape, an extending end 10ze of the side surface sealing member 10z being water-tightly set in contact with a non-formation region 2v of the multilayer wiring layer 7 on the first surface 2i of the substrate 2 to thereby protect outer peripheral side surfaces 5g of the multilayer wiring layer 7.
