A lead arrangement includes a plurality of proximal leads, a distal lead, and a junction electrically and mechanically coupling the plurality of proximal leads to the at least one distal lead. Each proximal lead has a proximal end and a distal end and includes conductive contacts disposed along the proximal end and conductive wires coupled to the conductive contacts and extending to the distal end of the proximal lead. Each distal lead has a proximal end and a distal end and includes electrodes disposed along the distal end and conductive wires coupled to the electrodes and extending to the proximal end of the distal lead. The junction includes conductive tabs and a non-conductive material encapsulating the conductive tabs. The conductive wires of the at least one distal lead and the conductive wires of the plurality of proximal leads are attached to the conductive tabs of the junction.
