An ultrasound transducer includes an array of acoustic elements, an integrated circuit, and an interposer. The interposer includes conductive elements for electrically connecting the acoustic elements to the integrated circuit. The conductive elements are electrically connected to the integrated circuit. Solder is engaged between the acoustic elements and the conductive elements of the interposer such that the conductive elements of the interposer are electrically connected to the acoustic elements through the solder.
