An implantation pin kit and a method for implanting an implantation pin includes a cannulated implantation pin having a channel and a heating device. The channel of the pin extends in a longitudinal direction of the pin and connects a proximal opening at a proximal end of the pin with a distal opening at a distal end of the pin. The channel of the pin and the heating device are adapted such that the heating device can be accommodated within at least a portion of the channel of the pin. The heating device is adapted to thermally heat material comprised in at least one of the pin and the heating device. Thereby, meltable material of the pin can be liquefied or additional liquefied meltable material can be inserted into the pin and the liquefied material can then be push towards and out of the distal opening in order to augment and fix the implantation pin in a target structure.
