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BIOLOGICAL HEALTH-CARE WAFER, AND HEALTH-CARE FREE PATCH USING BIOLOGICAL HEALTH-CARE WAFER
专利权人:
LIAONING WEIWEI SHUKANG BIOTECHNOLOGY CO.; LTD.
发明人:
ZHANG, Yongcai,张永才,JIANG, Yunjing,江云静,GUAN, Zhaoli,关照利
申请号:
CNCN2016/079127
公开号:
WO2017/177390A1
申请日:
2016.04.13
申请国别(地区):
WO
年份:
2017
代理人:
摘要:
A biological health-care wafer, and a health-care free patch prepared using the biological health-care wafer. The biological health-care wafer comprises a biological microelectronic chip (3). The biological microelectronic chip (3) comprises at least one microelectronic integrated circuit module (31). The microelectronic integrated circuit module (31) comprises an induction receive coil (311), a micro information processing circuit (312), a high-speed cache (313), a crystal oscillator (314) and a transmitting coil (315), wherein the induction receive coil (311) is used for receiving a biological wave emitted by human cells and transmits same to the high-speed cache (313) through the micro information processing circuit (312), the crystal oscillator (314) generates resonance based on the biological wave in the high-speed cache (313) to amplify the wave, the amplified resonance wave is transmitted to the transmitting coil (315) through the micro information processing circuit (312), and the transmitting coil (315) feeds back the resonance wave to a biological wave emitter. The product is simple and rational in structure, a health-care function and device commonality can be taken account of simultaneously, and the use can be altered at will according to peoples needs to perform health-care of harmless cells.Linvention concerne une plaquette pour soins de santé biologique, et un patch libre de soins de santé préparé à laide de ladite plaquette pour soins de santé biologique. La plaquette pour soins de santé biologique comprend une puce microélectronique biologique (3). La puce microélectronique biologique (3) comprend au moins un module de circuit intégré microélectronique (31). Le module de circuit intégré microélectronique (31) comprend une bobine de réception dinduction (311), un microcircuit de traitement de linformation (312), une mémoire cache à grande vitesse (313), un oscillateur à cristal (314) et une bobine de transmission (315), caractérisé en ce que la bobin
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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