Provided is a composition comprising:(A) a silicone polymer of the Formula (I):M1aM2bM3cD1dD2eD3fT1gT2hT3iQj.wherein: M1=R1R2R3SiO1/2 M2=R4R5R6SiO1/2 M3=R7R8R9SiO1/2 D1=R10R11SiO2/2 D2=R12R13SiO2/2 D3=R14R15SiO2/2 T1=R16SiO3/2 T2=R17SiO3/2 T3=R18SiO3/2 Q=SiO4/2 where R1, R2, R3, R5, R6, R8, R9, R10, R11, R13, R15, R16 are independently chosen from a hydrogen, a C1-C60 aliphatic or aromatic group or C1-C60 alkoxy group；R4, R12, R17 are independently chosen from a C1-C10 alkyl, a C1-C10 alkoxy, or R19-A-R20—； where A is chosen from a group comprising an unsaturated cyclic moiety chosen from an aromatic group, a fused aromatic group, an unsaturated alicyclic group, an unsaturated heterocyclic group, or a combination of two or more thereof； R19 is chosen from a —；H, a C1-C10 alkyl, allyl, vinyl, alkoxy, allyloxy, vinyloxy, acrylate, or methacrylate； and R20 is chosen from a divalent organic group；R7, R14, R18 are independently selected from hydrogen or OR22 or unsaturated monovalent radicals or radicals containing heteroatom such as oxygen, nitrogen, sulfur or radicals containing organosilane groups； andthe subscripts a, b, c, d, e, f, g, h, i, j are zero or positive subject to the following limitations: 2≤；a+b+c+d+e+f+g+h+i+j≤；1000, b+e+h>；0 and c+f+i≥；0 andB) a thermally conductive filler.
