PROBLEM TO BE SOLVED: To provide an ultrasonic transducer element chip that is a thin-type and has strength to withstand pressing force in a thickness direction of a substrate.SOLUTION: Openings are disposed in an array on a substrate. Ultrasonic transducer elements are provided to the respective openings on a first surface of the substrate. A reinforcement member 52 is fixed to a second surface of the substrate opposite to the first surface. Grooves 53 are formed on a surface of the reinforcement member 52. The grooves 53 are disposed side by side at an interval L smaller than an opening width S.COPYRIGHT: (C)2014,JPO&INPIT【課題】薄型で、かつ、基板の厚み方向の押圧に耐える強度を有する超音波トランスデューサー素子チップは提供される。【解決手段】基板には開口がアレイ状に配置される。基板の第1面では個々の開口に超音波トランスデューサー素子が設けられる。第1面の反対側の基板の第2面には補強部材52が固定される。補強部材52の表面には溝53が形成される。溝53は、開口幅Sよりも小さい間隔Lで並べられる。【選択図】図5
