レーザ加工方法およびレーザ加工装置

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专利权人:

三菱電機株式会社

发明人:

平山 玲王奈,藤川 周一,桂 智毅

申请号：

JP20150547694

公开号：

JP6113299(B2)

申请日:

2014.10.10

申请国别(地区):

日本

年份:

2017

代理人:

摘要：

A laser processing method that can reduce warpage occurring in a glass and reduce a stress generated on the glass at a time of releasing a protective material from the glass. The laser processing method includes: forming the protective materials on both surfaces of the glass; processing the glass by radiating a laser beam onto the glass together with the protective materials after the protective material formation; and releasing the protective materials from the glass after the laser processing.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/