Thin section identification

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专利权人:

닛토덴코 가부시키가이샤

发明人:

이모토, 타카시,니시오, 아키노리

申请号：

KR1020187026198

公开号：

KR1020180115279A

申请日:

2016.11.29

申请国别(地区):

KR

年份:

2018

代理人:

摘要：

The thin section identification (X1) includes support chip (10) and bonding sheet (20). Support chip (10) identification label (M1). Adhesive sheet (20) has a laminar structure, and it includes substrate layers (21) and adhesive phase (22). Adhesive layer (22) can be pasted from support chip and remove (10). In addition, adhesive sheet (20) identification label (M2). The thin section identification (X1) is applicable to the admissibility for continuing to guarantee evidence collection expert evidence.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/