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SEED-HOUSING MEDIUM
专利权人:
TOPPAN PRINTING CO LTD
发明人:
MATSUI HATSUNE,OGASAWARA MIKI
申请号:
JP20100033452
公开号:
JP2011167118(A)
申请日:
2010.02.18
申请国别(地区):
日本
年份:
2011
代理人:
摘要:
PROBLEM TO BE SOLVED: To provide a seed-housing medium for housing the seeds of a plant or the like in a substrate material, which enables stable germination and growth irrespective of the material quality of cover film or the like, and the environment of a medium. SOLUTION: Since the seeds 5 and a polymer absorbent material 6 are housed together at a seed-housing part provided in the substrate material 2 and the seed-housing part is sealed with the cover film 7, the polymer adsorbent material 6 adsorbs water in soil on being buried in the soil to increase its volume, and the cover film 7 can surely be destroyed to increase the germination rate of the seeds 5. COPYRIGHT: (C)2011,JPO&INPIT
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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