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整流板のパラメータを決定する方法
专利权人:
日本電信電話株式会社
发明人:
境野 英朋,松尾 啓吾,中村 雅之
申请号:
JP20130186674
公开号:
JP6077970(B2)
申请日:
2013.09.09
申请国别(地区):
日本
年份:
2017
代理人:
摘要:
PROBLEM TO BE SOLVED: To provide a method for determining parameters of current plates for improving exhaust heat efficiency of an ICT device while considering a specific state per server room.SOLUTION: A method for determining parameters of current plates comprises the steps of: modeling a server room on the basis of dimension information of the server room, position information of an ICT device, dimension information of the ICT device, and parameters of the current plates, and simulating a flow of cool air supplied into the ICT device on the basis of temperature information of the cool air blown out from an indoor machine, air volume information of the cool air blown out from the indoor machine, heat output information generated from a load of the ICT device, and air volume information of a fan of the ICT device; calculating a suction temperature and an exhaust temperature of the ICT device while changing the parameters of the current plates; and calculating exhaust heat efficiency on the basis of the sucti
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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