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Process mapping of cooling rates and thermal gradients
专利权人:
Carnegie Mellon University;Wright State University
发明人:
Beuth, Jr. Jack Lee,Klingbeil Nathan W.,Gockel Joy Davis
申请号:
US201314422092
公开号:
US9939394(B2)
申请日:
2013.08.16
申请国别(地区):
美国
年份:
2018
代理人:
Fish & Richardson P.C.
摘要:
A method performed by one or more processing devices includes conducting a plurality of tests of a manufacturing process. Each test is conducted at a different combination of at least a first process variable and a second process variable, and each test comprises locally heating a region of a structure, where the local heating results in formation of a thermal field in the structure, and assessing a temperature derivative of the thermal field. Based on results of the plurality of tests, a process map of the temperature derivative of the thermal field is generated, with the temperature derivative based on a function of the first process variable and the second process variable.
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