An image pickup apparatus 1 includes: a rectangular parallelepiped image pickup chip 10 made of a semiconducting material, in which a plurality of function portion patterns including a light-receiving portion 11 are formed on a first main surface 10SA and a cover glass 30 in which an alignment marks is formed at each of at least two places that are in a predetermined positional relationship with a function portion pattern, and which is made of a transparent material that is bonded via an adhesive layer so as to cover the light-receiving portion 11.
