The present invention provides an adhesive preparation package containing an adhesive preparation and a packaging film(s) enclosing said preparation, the packaging films being heat-sealed around the adhesive preparation, wherein the heat-sealed portion of the packaging film comprises an embossed heat-sealed portion and a flat heat-sealed portion, and the embossed heat-sealed portion and the flat heat-sealed portion each form a pattern surrounding the periphery of the adhesive preparation. The adhesive preparation package of the present invention is free of occurrence of pinholes in a heat-sealed portion and can maintain superior air-tightness and sterility.
