An imaging unit includes: an optical system including a plurality of lenses； a prism configured to reflect light condensed by the optical system； a semiconductor package including an image sensor configured to generate an electrical signal by receiving light incident from the prism and performing photoelectric conversion on the received light, and including a connection electrode on a back surface of the semiconductor package； and a multi-layer substrate including a connection terminal on a top surface of the multi-layer substrate, the connection electrode being connected to the connection electrode via a conductive member. A concave portion in which an electronic component is mounted is formed in a region on a back surface of the multi-layer substrate, the region corresponding to a region where the connection terminal is formed.
