Provided herein are topical formulations containing copper ions and methods of treating radiation dermatitis, damage caused by radiation therapy, or other radiation-induced damage conditions in various areas of the body using such formulations. Methods of treating radiation dermatitis using topical copper ion treatments are provided. A topical treatment in its basic form comprises a biocompatible copper ion solution or suspension obtained by leaching of the copper ions from copper metal. The copper ion solution or suspension is combined with various carriers to form the copper ion treatment including creams, gels, lotions, foams, pastes, tampons, solutions, suppositories, body wipes, wound dressings, skin patches, and suture material. Methods of making the copper ion solution or suspension from solid copper metal in a biocompatible solution are also provided.
