A topical copper ion treatment in basic form comprises a copper ion-containing solution composed of a biocompatible solution containing copper ions obtained by leaching of the copper ions from copper metal into the solution. The copper ion-containing solution can be combined with various carriers to form various forms of the copper ion treatment including creams, gels, lotions, foams, pastes, tampons, solutions, suppositories, body wipes, wound dressings, skin patches, and suture material. A method of making the copper ion-containing solution involves placing solid copper metal in a quantity of a biocompatible solution and maintaining the solution at a specified temperature for a predetermined period of time during which copper ions leach from the copper metal into the solution, and thereafter separating the solution from the solid copper metal.
