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SPINAL IMPLANT PACKAGING
专利权人:
Inc.;Warsaw Orthopedic
发明人:
Leigh Anna Folger,David Mire,Caleb D. Smith,Christine Carmer
申请号:
US16225899
公开号:
US20200197149A1
申请日:
2018.12.19
申请国别(地区):
US
年份:
2020
代理人:
摘要:
A spinal implant package includes a tray having a body including spaced apart first and second cavities. The body includes a third cavity between the first and second cavities. The tray includes a first connecting feature that is movable relative to the body. A lid is coupled to the tray by a hinge. The lid includes a second connecting feature that is movable between a first position in which a bottom surface of the second connecting feature directly engages a top surface of the first connecting feature and a second position in which a top surface of the second connecting feature directly engages a bottom surface of the first connecting feature to provisionally fix the lid to the tray.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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