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Method of fabricating high-density hermetic electrical feedthroughs
专利权人:
Kedar G. Shah
发明人:
Kedar G. Shah,Satinderpall S. Pannu,Terri L. Delima
申请号:
US14009332
公开号:
US09048012B2
申请日:
2012.04.18
申请国别(地区):
US
年份:
2015
代理人:
摘要:
A method of fabricating electrical feedthroughs selectively removes substrate material from a first side of an electrically conductive substrate (e.g. a bio-compatible metal) to form an array of electrically conductive posts in a substrate cavity. An electrically insulating material (e.g. a bio-compatible sealing glass) is then flowed to fill the substrate cavity and surround each post, and solidified. The solidified insulating material is then exposed from an opposite second side of the substrate so that each post is electrically isolated from each other as well as the bulk substrate. In this manner a hermetic electrically conductive feedthrough construction is formed having an array of electrical feedthroughs extending between the first and second sides of the substrate from which it was formed.
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