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半芳香族の成形組成物とその使用方法
专利权人:
发明人:
申请号:
JP20100275076
公开号:
JP5722018(B2)
申请日:
2010.11.22
申请国别(地区):
日本
年份:
2015
代理人:
摘要:

Polyamide molding composition comprises (in wt.%): (a) a copolyamide (40-90) comprising (a1) 1,6-hexanediamine and 1,10-decanediamine, and (a2) terephthalic acid and at least one further polyamide forming monomer comprising dicarboxylic acid with 8-18 carbon atoms, laurolactam and/or aminolauric acid; (b) macromolecular plasticizer (10-40), with a condition that the macromolecular plasticizer may be partially replaced by low molecular weight plasticizer; and (c) additives (0-20). Independent claims are also included for: (1) a molding produced from the above polyamide molding composition, preferably in the form of a fluid container or a fluid pipe, for the automobile industry for conducting fluids including fuels, coolants, urea or its solution and/or oils, preferably a pipeline with an elongation at break of at least 100%; and (2) manufacturing the molding, comprising producing the molding, preferably pipeline in an extrusion process using a screw extruder at a cylinder temperature of 280-320[deg] C.

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