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Method for producing a hermetically sealed casing intended for encapsulating an implantable device, and corresponding casing
专利权人:
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
发明人:
Simon Perraud,Nicolas Karst
申请号:
US14674489
公开号:
US09387336B2
申请日:
2015.03.31
申请国别(地区):
US
年份:
2016
代理人:
摘要:
Method for producing a hermetically sealed casing, comprising the following steps:a) supplying a ceramic substrate (20),b) supplying a metal surround (21) and placing it facing the said substrate (20),c) forming a first hermetically sealed joint (22) at the interface between the said substrate (20) and the said metal surround (21), in order to assemble them and form an assembly,d) superposing a cover (23) on the said assembly,e) forming a second hermetically sealed joint (24) between an upper face of the metal surround (21) which is the opposite face to the said interface, and the cover (23), in order to obtain the said casing,characterized in that, during step c), the first hermetically sealed joint (22) is formed on a portion of the said interface and in that prior to step c), the method involves an additional step consisting in placing a ceramic surround (25) on the upper face of the metal surround so as to partially cover the said face of the metal surround, the projected surface of the said ceramic surround in a plane of projection covering the projected surface of the said first joint in this same plane of projection.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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