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METHOD FOR PRODUCING A HERMETIC HOUSING FOR ENCAPSULATING AN IMPLANTABLE DEVICE AND CORRESPONDING HOUSING
专利权人:
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
发明人:
NICOLAS KARST,SIMON PERRAUD
申请号:
FR1359004
公开号:
FR3010648B1
申请日:
2013.09.19
申请国别(地区):
FR
年份:
2015
代理人:
摘要:
The invention relates to a method for manufacturing a thin airtight housing, which includes: (a) providing a first element in which a recess is made; (b) forming a solder joint in said recess, said joint being at least partially inserted in said recess; (c) placing a second element opposite said first element and said joint; (d) forming a first airtight seal between the first and second elements in order to assemble same and form an assembly; (e) placing a cover on top of said assembly; and (f) forming a second airtight seal between said assembly and said cover.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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