A method for encapsulating a semiconductor device (1), which at least one on a substrate (4) arranged semiconductor chip (5), said method comprising the steps of:– Application of an elastic dam (11) on the semiconductor chip (5) in such a way that it comprises a surface (18) to be sealed completely around the,– Introduction of the on the substrate (4) arranged in a semiconductor chip (5) consisting of a lower and an upper mold half (14, 2) existing molding tool (15),– Closing of the mold tool (15) with the use of pressure, so that with an inner surface (16) of the upper mold half (2) of the elastic dam (11) completely and contacted by a defined distance is compressed, so that the dam (11), the surface being sealed (18) of the semiconductor chip (5) and a part of the inner surface (16) of the upper mold half (2) of the mold tool (15), in the closed condition of the molding tool (15) a closed cavity (19) are formed, which is sealed against press mass (20) is,– Encapsulation of the semiconductor component..
