ПЬЮ Рэндалл Б. (US),РАЙЕЛЛ Джеймс Дэниел (US),ОТТС Дэниел Б. (US),ТОНЕР Адам (US),ФЛИТШ Фредерик А. (US)
申请号：
RU2013134475/14
公开号：
RU2013134475A
申请日:
2013.07.23
申请国别(地区):
RU
年份:
2015
代理人:
摘要：
1. A method for producing an electronic device, comprising the steps of: forming a first substrate with at least a surface region that is non-planar； attaching electrical contacts to a surface region； and attaching an electronic element comprising a flexible semiconductor to electrical contacts, wherein the flexible semiconductor is bent to match a non-planar surface. The method of claim 1, further comprising the step of placing the electronic device in an ophthalmic device. The method of claim 2, wherein the surface region comprises a curved surface forming a support for at least a portion of the cylindrical electronic element. The method of claim 3, wherein the radial axis of the cylindrical electronic element is oriented along the axis of the optical path of the ophthalmic device. The method of claim 4, wherein the design of the electronic device is configured to include at least one backup element. The method of claim 4, wherein the semiconductor contains crystalline silicon. The method of claim 4, wherein the semiconductor comprises polycrystalline silicon. The method of claim 4, wherein the semiconductor contains amorphous silicon. The method of claim 2, wherein the surface region comprises a curved surface forming a support for at least a portion of the conical shaped electronic element. The method of claim 9, wherein the radial axis of the conical shape is essentially oriented along the axis of the optical path of the ophthalmic device. The method of claim 10, wherein the design of the electronic device is such that it includes at least one backup�1. Способ получения электронного устройства, содержащий этапы, на которых:формируют первую подложку с по меньшей мере областью поверхности, которая является неплоской；прикрепляют электрические контакты на область поверхности； иприкрепляют электронный элемент, содержащий гибкий полупроводник, к электрическим контактам, причем гибкий полупроводник изгибают для согласования с неплоской поверхностью.2. Способ по п. 1,
