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炸粉圓結構
专利权人:
HUANG; ZHEN-FU
发明人:
HUANG, ZHEN-FU,黄镇富,黃鎮富
申请号:
TW104219272
公开号:
TWM517996U
申请日:
2015.12.01
申请国别(地区):
TW
年份:
2016
代理人:
摘要:
The new type is a kind of fried round structure, which is a layer of fried cortex is set on the surface of the general round body to form the fried round with golden crispy appearance and Q soft multi-level taste inside, effectively improving the variability and taste of the round products and meeting the changing consumption demand.The utility model further spreads peanut powder, sugar powder, sesame powder, seaweed powder or nut like powder or granule condiment on the surface of fried dough, and can also pour liquid condiment or crispy layer such as condensed milk, caramel or soy sauce, further increase the level sense and flavor of fried dough, and improve the product value of fried dough.本新型為一種炸粉圓結構,其係在一般的粉圓本體的表面包覆設置一層炸皮層,構成外表金黃酥脆且內部Q軟的多層次口感的炸粉圓,有效提升粉圓產品的變化性及口感,滿足不斷變化的消費需求。本新型進一步於炸粉圓的表面撒上花生粉、糖粉、芝麻粉、海苔粉或堅果類的粉狀或顆粒狀調味品,也可以澆淋煉乳、焦糖或醬料等液狀調味品或脆皮層,進一步增加炸粉圓的層次感和風味,並提高炸粉圓的產品價值。
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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