The present invention relates to a device for cutting out from a bundle laser. generated by a laser source (1), the apparatus comprising: - a system for shaping (3) positioned on the trajectory of said beam, in order to modulate the phase of the wave front and / or the amplitude of the beam laser. so as to obtain a beam laser. modulated in phase and / or amplitude modulation pre-set according to a calculated in order to distribute the energy of the beam laser. in a plurality of points of impact, in its focal plane corresponding to a cutting plane, said plurality of points of impact, defining a pattern of the cutting, - a control unit (6) for controlling the system of shaping, the said control unit is programmed to transmit at least the first and second control signals: ∘ the first control signal associated with the modulation of the phase of the wave front and / or the amplitude of the beam laser. according to a first modulation pre-set calculated in order to distribute the energy of the beam laser. in a plurality of points of impact in the focal plane of the system of shaping, the first impact points constituting a first pattern,) the second control signal associated with the modulation of the phase of the wave front and / or the amplitude of the beam laser. according to a second modulation pre-set calculated in order to distribute the energy of the beam laser. in a plurality of second impact points in the focal plane of the system of shaping, the second impact points constituting a second pattern is different from the first pattern.La présente invention concerne un appareil de découpe à partir dun faisceau L.A.S.E.R. généré par une source laser (1), lappareil comprenant :- un système de mise en forme (3) positionné sur la trajectoire dudit faisceau, pour moduler la phase du front donde et/ou lamplitude du faisceau L.A.S.E.R. de sorte à obtenir un faisceau L.A.S.E.R. modulé en phase et/ou en amplitude selon une consigne de modulation calculée pour répartir lénergie
