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METHODS AND APPARATUS FOR POLARIZED WAFER INSPECTION
专利权人:
KLA-Tencor Corporation
发明人:
Liu Sheng,Zhao Guoheng
申请号:
US201715847249
公开号:
US2018364177(A1)
申请日:
2017.12.19
申请国别(地区):
美国
年份:
2018
代理人:
摘要:
This system comprises an illumination optics subsystem for generating and directing an incident beam towards a defect on a surface of a wafer. The illumination optics subsystem includes a light source for generating the incident beam and one or more polarization components for adjusting a ratio and/or a phase difference for the incident beam's electric field components. The system includes a collection optics subsystem for collecting scattered light from the defect and/or surface in response to the incident beam, and the collection optics subsystem comprises an adjustable aperture at the pupil plane, a rotatable waveplate for adjusting a phase difference of electric field components of the collected scattered light, and a rotatable analyzer. The system includes a controller for selecting a polarization of the incident beam, obtaining a defect scattering map from the defect, obtaining a surface scattering map from the background surface, and determining a configuration of the polarization components, aperture
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中国工程科技知识中心
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