An imaging unit includes: a semiconductor package having an image sensor and having a connection electrode on a back side thereof； a circuit board having connection electrodes on front and back sides thereof, the connection electrode on the front side being connected to the connection electrode of the semiconductor package； a deformed circuit board having first, second, and third faces and having connection electrodes on the first, second, and third faces, respectively, a connection electrode on the first face being connected to the connection electrodes of the circuit board； an electronic component mounted on the back side of the circuit board； and cables connected to the connection electrodes on the second and third faces. The electronic component is housed in a recess of the deformed circuit board. The circuit board, the deformed circuit board, and the cables are located within a projection plane in an optical-axis-direction of the semiconductor package.
