Wearable devices with increased adhesion
- 专利权人:
- Bose Corporation
- 发明人:
- Shawn J. Prevoir,Kai Gao
- 申请号：
- US15967994
- 公开号：
- US10506326B2
- 申请日:
- 2018.05.01
- 申请国别(地区):
- US
- 年份:
- 2019
- 代理人:
- 摘要：
- Headphone ear tips are made with an outer surface that changes its coefficient of friction. The outer surface is coated with photochromic compound, hierarchical microstructures, fibers formed through electrostatic flocking, or a combination thereof.
- 来源网站：
- 中国工程科技知识中心
