Methods and systems are provided for cooling a surface of a cryogenic application device using a cryogen having a critical point defined by a critical-point pressure and a critical-point temperature, the system comprising: a means for raising a pressure of the cryogen above a pressure value determined to provide the cryogen at a reduced molar volume that prevents vapor lock and a means for thereafter placing the cryogen in thermal communication with the surface of the cryogenic application device to increase a temperature of the cryogen along a thermodynamic path that maintains a pressure greater than a determined pressure value for the duration that the cryogen and the surface are in thermal communication.
