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Method and system for integration of electronic sensors with thermal cooling system
专利权人:
Inc.;Magic Leap
发明人:
Seyed, Shurhabeel Zamir,Pedroza, Carlos Julio Suate,Shee, Koon Keong
申请号:
AU2018299893
公开号:
AU2018299893A1
申请日:
2018.07.09
申请国别(地区):
AU
年份:
2020
代理人:
摘要:
A system includes a computing device operatively coupled to one or more user interface components, and a thermal cooling system for cooling the computing device. The system further includes a proximity sensor positioned adjacent a thermal vent and configured to set a proximity flag in response to detecting an object in proximity to the thermal vent. The system further includes an orientation sensor coupled to the computing device and configured to set an orientation flag in response to detecting an orientation of the computing device being such that the thermal vent is facing downward. The system further includes a processor communicatively coupled to the proximity sensor, the orientation sensor, and the one or more user interface components. The processor is configured to provide an alert for output through the one or more user interface components in response to having the proximity flag set or the orientation flag set.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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