An image pickup apparatus according to an embodiment includes: an image pickup device chip including an image pickup device formed on a first principal surface thereof and an external terminal for the image pickup device formed on a second principal surface thereof； a wiring board including a distal end portion including a connection pad, a flexure portion flexed at an angle of no less than 90 degrees, and an extending portion, the wiring board including a wiring layer extending from the distal end portion to the extending portion via the flexure portion, the wiring board being kept within a space immediately above the second principal surface of the image pickup device chip； a bonding layer that joins the second principal surface of the image pickup device chip and the distal end portion of the wiring board； and a bonding wire that electrically connects the external terminal and the connection pad.
