The invention relates to a hard hypromellose capsule. The said capsule comprises hypromellose having methoxygroup between 28 to 30% and hydroxypropyl group between 7,6 to 12%, water, colouring agent between 0.1 to 10%, antimicrobial agent between 0.1 to 3 % , surfactant between 0.1 to 3 % but without any film forming agent and gelling system. In addition, invention provides a process of manufacturing the hard hypromellase capsule. The following steps involved in the process: (i) Dispersing Hypromellose in hot water of temperature above 75 deg C and then cooling it to temperature below 10 deg C to completely solubalise the powder. (ii) The Hypromellose is of substitution having methoxy content between 28 to 30 % and hydroxypropyl content between 7.6 to 12%. The powder to water ration to be between 15 to 25%. The 2% viscosity range of Hypromellose polymer to be between 4 to 15% (iii) The aqueous composition above can have processing aids such as surfactant, anti microbial agents, colourants and other processing aids based on requirement between 0.1 to 10%. (iv) Pins are preheated between 80 to 110 deg C at the time of dipping in to aqueous composition. (v) The dipping solution temperature is maintained between 15 to 25 deg c. (vi) The preheated pins are dipped in this aqueous composition and then withdrawn at a pre defined sequence of time and velocity profile.
