Embodiments disclosed herein are directed to a method for forming an all-in-one packing, pad, and shoe substitute for a hoof having a hoof side wall and bottom wall forming an interior recess, where the method comprises adding a resin formulation to the interior recess of the hoof to form a resin plug that substantially fills an entirety of the interior recess and extends a predetermined amount beyond the bottom wall of the hoof for ground contact. The resin formulation is configured to freely flow throughout the interior recess of the hoof when added thereto and cure at a predetermined rate to form the resin plug without spillage of the resin formulation from the hoof. The formed resin plug is not attached to an external shoe. Embodiments are also directed to the all-in-one packing, pad, and shoe substitutes for a hoof formed via such method.
