半導体モジュール及び昇圧整流回路

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专利权人:

三菱電機株式会社

发明人:

酒井 伸次,加藤 正博,田中 智典

申请号：

JP20170025625

公开号：

JP6289691(B2)

申请日:

2017.02.15

申请国别(地区):

日本

年份:

2018

代理人:

摘要：

PROBLEM TO BE SOLVED: To provide a technology capable of suppressing temperature rise by a linear regulator function.SOLUTION: A semiconductor module 11 includes: a voltage generation section 15; and a heat dissipation mechanism consist of an isolating heat dissipation sheet 16 and a heat sink 17. The voltage generation section 15 can generate power voltage for driving a step-up converter 59 from voltage boosted by the step-up converter 59, by using a built-in linear regulator function. The voltage generation section 15 is installed on the heat dissipation mechanism.SELECTED DRAWING: Figure 1

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/