A body attachment wafer for an ostomy device is provided, which body attachment wafer has a stoma opening, and an adhesive layer. The adhesive layer is covered by a release layer, having an opening which corresponds to the stoma opening. The release layer is divided along at least one dividing line from the stoma opening to the periphery of the body attachment wafer, and the release sheet includes a first grip tab extending from the release sheet in the area of the at least one dividing line. The first grip tab is arranged to overlap the release sheet on the other side of the dividing line.
