PROBLEM TO BE SOLVED: To provide a method of manufacturing an ultrasonic probe more easily.SOLUTION: In a method of manufacturing an ultrasonic probe, when connecting an oscillator 10 and a relay substrate 30 in a state where an oscillator side electrode 20 formed on the back face of the oscillator 10 and a substrate side electrode 32 formed on the upper face of the relay substrate 30 are closely contacted, a surface treatment for improving wettability is performed in advance only for a region to be positioned, that is, a formation region of the oscillator side electrode substrate 20 and that of the substrate side electrode 32. Thereafter, liquid adhesive 38 is applied on the electrode formation region, then the oscillator 10 and relay substrate 30 are superposed. Then, thanks to the surface tension of the liquid adhesive 38 that is spread only over the electrode formation region having improved wettability, the oscillator 10 and relay substrate 30 are automatically aligned. Then, after the liquid adhesive 38 between the electrodes is pushed out by pressing the oscillator 10 against the relay substrate 30, the adhesive is heated while being pressurized, and cured.COPYRIGHT: (C)2012,JPO&INPIT【課題】より簡易に超音波探触子を製造でき得る製造方法を提供する。【解決手段】振動子10の背面に形成された振動子側電極20と中継基板30の上面に形成された基板側電極32とを互いに密着させた状態で、振動子10および中継基板30を接合する際には、予め、位置合わせすべき範囲、すなわち、振動子側電極基板20の形成範囲、および、基板側電極32の形成範囲にのみ、濡れ性向上のための表面処理を施す。その後、電極形成範囲に液状接着剤38を塗布し、振動子10および中継基板30を重ね合わせる。このとき、濡れ性が高まった電極形成範囲にのみ広がった接着剤38の表面張力により、自動的に、振動子10および中継基板30の位置決めがなされる。その後、振動子10を中継基板30に押し当て、電極間の接着剤38を押し出した後、加圧しながら加熱し、接着剤を硬化させる。【選択図】図1
