Yoshimi Inc.;Akiyama Medical Co., Ltd.;Kyushu University, National University Corporation
发明人:
YOSHIMI Yukiharu,KAWAI Hirohisa,IKEDA Tetsuo
申请号：
EP17769882
公开号：
EP3434198A4
申请日:
2017.03.06
申请国别(地区):
EP
年份:
2019
代理人:
摘要：
A cooling device 10 may be configured to cool a shape-memory alloy member. The cooling device 10 may include: a cooling unit 20 configured to cool the shape-memory alloy member or a part that is to make contact with the shape-memory alloy member； a refrigerant supply pipe 30, 31 including one end connected to a refrigerant supply source 34 and other end connected to the cooling unit 20, the refrigerant supply pipe 30, 31 configured to supply a refrigerant supplied from the refrigerant supply source 34 to the cooling unit 20； and a refrigerant discharge pipe 32, 33 including one end connected to the cooling unit 20, the refrigerant discharge pipe 32, 33 configured to discharge the refrigerant discharged from the cooling unit 20 from other end of the refrigerant discharge pipe 32, 33.
