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HEAD-COOLING PILLOW AND HEAD-COOLING DEVICE
专利权人:
发明人:
申请号:
EP11840139.7
公开号:
EP2638886A1
申请日:
2011.09.30
申请国别(地区):
EP
年份:
2013
代理人:
摘要:
[Problems to be solved]To provide a head cooling pillow which is capable of enhancing cooling efficiency for the head, suppressing pressure rise in the inside of the pillow, and improving placing feeling of the head on the pillow.[Means to solve the Problems]The head cooling pillow 2 includes a pillow main body 11 which is formed in a bag shape and is structured so that refrigerant is passed through its inside, a partition member 12b which is disposed in the inside of the pillow main body 11 for forming the flow passage 13 through which the refrigerant is passed, and a support member 12c structure to support the head of a user. In the head cooling pillow 2, the head is cooled by the refrigerant passing through the flow passage 13.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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