A head cooling pillow is provided that is capable of enhancing cooling efficiency for the head, suppressing pressure rise in the inside of the pillow, and improving placing feeling of the head on the pillow. The head cooling pillow includes a pillow main body which is formed in a bag shape and is structured so that refrigerant is passed through its inside, a partition member which is disposed in the inside of the pillow main body for forming the flow passage through which the refrigerant is passed, and a support member structure to support the head of a user. In the head cooling pillow, the head is cooled by the refrigerant passing through the flow passage.
