This adhesion prevention film for medical devices is a single-layer or multilayer adhesion prevention film that is formed on the surface of a medical device. This adhesion prevention film for medical devices comprises an outermost layer that contains a plurality of conductive particles and a resin having a continuously usable temperature of 200° C. or higher. The surface of the outermost layer is provided with recesses and projections by having parts of the plurality of conductive particles exposed from the resin.