To improve performance of an ultrasonic inspection apparatus including a capacitance detection type ultrasonic sensor that has a gap between electrodes and vibrates a membrane.SOLUTION: A circular semiconductor chip CHP including a cell array in which a plurality of cells, each of which is a capacitance type device with a gap between upper and lower electrodes, are laid out in a circle in plan view and a thermal stress film 6, covering a back surface of the semiconductor chip CHP, made of a material having a larger thermal expansion coefficient than silicon are mounted on a chip holder CH having a recess 40 on an upper surface. Since the thermal stress film 6 has a larger compressive stress than the semiconductor chip CHP, a center of the semiconductor chip CHP is curved downward and is bonded to a surface of the recess 40.SELECTED DRAWING: Figure 2【課題】電極間に空隙を有し、メンブレンを振動させる容量検出型の超音波センサを含む超音波検査装置の性能を向上させる。【解決手段】上下の電極間に空隙を有する静電容量型デバイスであるセルを平面視の円内に複数敷き詰めたセルアレイを備えた円形の半導体チップＣＨＰと、半導体チップＣＨＰの裏面を覆い、シリコンよりも熱膨張係数が大きい材料から成る熱応力膜６とを、上面に凹部４０を有するチップホルダＣＨ上に搭載する。熱応力膜６は半導体チップＣＨＰよりも圧縮応力が大きいため半導体チップＣＨＰは中央部が下方向に湾曲し、凹部４０の表面に接着されている。【選択図】図２
