Alexander Chelminski,Dan P. Rogers,Elizabeth A. Schlueter,Miguel Montero
申请号：
US16802207
公开号：
US20200275999A1
申请日:
2020.02.26
申请国别(地区):
US
年份:
2020
代理人:
摘要：
Packaging systems for dental implants and methods for implanting a packaged implant are provided herein. The packaging system includes a housing and a cap forming an enclosure for a dental implant and corresponding healing screw. The housing includes a first and second base portion that interact with a platform that receives a portion of the dental implant to present the dental implant to a user during use.
