Michael Raymond Weatherspoon,Louis Joseph Rendek, Jr.
申请号：
US15234094
公开号：
US09892984B2
申请日:
2016.08.11
申请国别(地区):
US
年份:
2018
代理人:
摘要：
An electronic package includes a semiconductor die, conductive pillars extending outwardly from the semiconductor die, and a liquid crystal polymer (LCP) body surrounding the semiconductor die and having openings therein receiving respective ones of the conductive pillars. A first interconnect layer is on the LCP body and contacts the openings. Conductive bodies are in the openings to connect the conductive pillars to the first interconnect layer.
